bd9e202fp4-z is a single synchronous buck dc/dc converter with built-in low on-resistance power mosfets. the light load mode control provides excellent efficiency characteristics in light-load conditions, which make the product ideal for equipment, and devices that demand minimal standby power consumption. bd9e202fp4-z is a current mode control dc/dc converter and features good transient response. it includes internal phase compensation. it achieves the high power density and offers a small footprint on the pcb by employing small package.

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。
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主要规格

 
型号 | bd9e202fp4-ztl
status | 推荐品
封装 | tsot23-6cj
包装数量 | 3500
最小独立包装数量 | 3500
包装形态 | taping
rohs |

特性:

ch

1

integrated fet / controller

integrated fet

topology

buck

synchronous / nonsynchronous

synchronous

vin1(min.)[v]

4.5

vin1(max.)[v]

28

vout1(min.)[v]

0.7

vout1(max.)[v]

22.4

iout1(max.)[a]

2

sw frequency(max.)[mhz]

0.5

light load mode

yes

en

yes

pgood

no

operating temperature (min.)[°c]

-40

operating temperature (max.)[°c]

85

package size [mm]

2.8x2.9 (t=1.1)

特点:

  • single synchronous buck dc/dc converter
  • light load mode control
  • frequency spread spectrum
  • internal phase compensation
  • over voltage protection (ovp)
  • over current protection (ocp)
  • short circuit protection (scp)
  • thermal shutdown protection (tsd)
  • under voltage lockout protection (uvlo)
  • reduced external diode
  • tsot23-6cj package

reference design / application evaluation kit

 
    • evaluation board - bd9e202fp4-evk-001
    • this evaluation board was developed for rohm's single synchronous buck dc/dc converter bd9e202fp4-z. bd9e202fp4-z is a synchronous buck dc/dc converter with built-in low on resistance power mosfets. the light load mode control provides excellent efficiency characteristics in light-load conditions, which makes the product ideal for equipment and devices that demand minimal standby power consumption. bd9e202fp4-z has frequency spread spectrum. bd9e202fp4-z includes internal phase compensation. it achieves the high power density and offers a small footprint on the pcb by employing small package.

  • user guide
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